Wafer-Level Packaging of Optoelectronic Chips using Sea of Leads Electrical and Optical I/O Interconnections
Annual Meeting; 17TH, IEEE Lasers & Electro-optics Society:; LEOS 2004 ; 2004 ; Rio Grande, Puerto Rico
2004-01-01
2 pages
IEEE cat. no. 04CH37581
Aufsatz (Konferenz)
Englisch
Lasers , Electro-optics , LEOS
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