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    Title :

    Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging


    Contributors:
    Zhan, Z. (author) / Yu, L. (author) / Wei, J. (author) / Zheng, C. (author) / Sun, D. (author) / Wang, L. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 21 , 2 ; 451-455


    Publication date :

    2015-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




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    Application Specific InterConnection System for Cutting Edge Packaging Technology

    Abbott, R. / Institute for Space and Nuclear Power Studies | British Library Conference Proceedings | 2001