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    Title :

    Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size


    Contributors:
    Yang, C. M. (author) / Jung, H. (author) / Park, J. H. (author) / Kim, H. Y. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 20 , 4/5 ; 889-897


    Publication date :

    2014-01-01


    Size :

    9 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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