Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    A dielectrophoretic chip packaged at wafer level


    Contributors:
    Iliescu, C. (author) / Tay, F. E. (author) / Xu, G. (author) / Yu, L. M. (author) / Samper, V. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 10-11 ; 987-992


    Publication date :

    2006-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size

    Yang, C. M. / Jung, H. / Park, J. H. et al. | British Library Online Contents | 2014


    A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

    Choi, W. C. / Ryu, J. Y. | British Library Online Contents | 2011


    Dielectrophoretic orientation.

    GUTTMAN, D. S. / HURWITZ, M. | AIAA | 1969


    Dielectrophoretic liquid expulsion.

    FAX, R. G. | AIAA | 1969


    Particle focusing in a contactless dielectrophoretic microfluidic chip with insulating structures

    Jen, C. P. / Maslov, N. A. / Shih, H. Y. et al. | British Library Online Contents | 2012