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encapsulation
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Encapsulations for organic devices and their evaluation using calcium corrosion tests
Encapsulations for organic devices and their evaluation using calcium corrosion tests
Intelligent energy management for a parallel hybrid electric vehicle in customer use
Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments
Non-hermetic embedded MCM technologies for automotive and other lower cost applications
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Metal-enclosed, air-insulated traction switchgear - developments and applications
UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden
Satellite X4: The 100-element self-scanned photodiode array experiment
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Reliability potential of epoxy based encapsulants for automotive applications
Reduction in size and weight of electronic modules through the evolution of packaging design
High density packaging for automotive applications
An improved, linear homopolar, electromagnetic launcher: STAR
Millimeterwellen-Mikrosysteme für Kraftfahrzeug und Verkehrsleittechnik
Novel component packaging for high current applications using power semiconductor devices
Assessment of high-heat-flux thermal management schemes
Multilayer alumina substrates for ECU (automotive electronics)
Druckfest gekapselte Elektromotoren für den Offshore-Einsatz
Reliability considerations for switched mode power supplies for use in railway applications
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Test method for availability of holes in height - temperature barrier on cementation process
Thermal management for high performance computing in spaceborne applications
Niederspannungsschaltanlagen in stoerlichtbogenfester Ausfuehrung fuer Offshore-Anwendung
Design limitations of powertrain electronics - automotive EMC challenges
Thermal characterization of a mercury arc lamp for a projection display system
A study of chip top delamination in plastic encapsulated packages under temperature loading
A Novel Technology for Thermal Control for ISP module for Space Applications
Motorola and MEMMS: the way up to a surface micromachined accelerometer
High efficiency, high reliability 2 kW inverter for aeronautical application
Optimized cooling systems for high-power semiconductor devices