Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–50 of 72 hits
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    Encapsulation, Electronics, Eccofoam

    F. N. Le Doux | NTIS | 1965
    Keywords: Encapsulation

    Warm Fog Modification Studies

    T. B. Smith | NTIS | 1971
    Keywords: Encapsulation

    Satellite X4: The 100-element self-scanned photodiode array experiment

    Brookman, A.K. / Pearson, M.J. | Tema Archive | 1974
    Keywords: KAPSELUNG

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archive | 1978
    Keywords: KAPSELUNG

    Thermal control systems for pod-mounted avionics

    Swain, E.F. / Letton, G.C. jun. | Tema Archive | 1979
    Keywords: VERKAPSELN

    P/M titanium reduces aerospace component costs

    Andersen, P.J. / Alber, N.E. / Thellmann, E.L. | Tema Archive | 1980
    Keywords: VERKAPSELN

    Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)

    Sattler, P.K. / Thoren, F. | Tema Archive | 1984
    Keywords: DRUCKFESTE KAPSELUNG

    1990's whispering giants

    Mitchell, C. | Tema Archive | 1985
    Keywords: VERKAPSELN

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation

    Drewitz, H. / Stiglmaier, M. | Tema Archive | 1989
    Keywords: KAPSELUNG

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archive | 1991
    Keywords: KAPSELUNG

    An electrostatic accelerator for ultrahypervelocity microprojectiles

    Conte, D. / Turchi, P.J. / Bird, G. et al. | Tema Archive | 1991
    Keywords: KAPSELUNG

    Non-hermetic embedded MCM technologies for automotive and other lower cost applications

    Fillion, R. / Wojnarowski, R. | Tema Archive | 1993
    Keywords: Kapselung , nichthermetische Kapselung

    Silicon sensors for automotive applications

    Rouet, J.P. / Grandjean, G. | Tema Archive | 1993
    Keywords: Kapselung

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archive | 1993
    Keywords: Kapselung

    On the isolation of science payloads from spacecraft vibrations

    Belvin, W.K. / Sparks, D.W. / Horta, L.G. et al. | Tema Archive | 1995
    Keywords: Kapselung

    Der Weg zum leisen Fahrzeug

    Leinfellner, H. / Sommer, D. / Leiter, K. | Tema Archive | 1996
    Keywords: Kapselung

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archive | 1996
    Keywords: Kapselung

    Microcoil speed position sensor for automotive applications

    Coulon, Y. de / Bourgeois, C. / Lambilly, H. de et al. | Tema Archive | 1997
    Keywords: Kapselung

    Motorola and MEMMS: the way up to a surface micromachined accelerometer

    Delpoux, A. | Tema Archive | 1997
    Keywords: Verkapseln

    The application of microtechnology to sensors for the automotive industry

    Smith, G. | Tema Archive | 1997
    Keywords: Verkapseln

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archive | 1997
    Keywords: Einkapselung

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archive | 1997
    Keywords: Verkapseln

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archive | 1998
    Keywords: Verkapseln

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Microwave multichip modules using low cost microwave chip on flex packaging technology

    McNulty, M. / Schnell, J. / Nixon, D. | Tema Archive | 1998
    Keywords: Verkapseln

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archive | 2001
    Keywords: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    New development of a wet brake system

    Nowak, S. | Tema Archive | 2002
    Keywords: Verkapseln

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)