Polyimide flex is an accepted substrate material for commercial and specialized electronic packaging applications. The advantages of using flex include ease of incorporating integrated passives (IP), roll-to-roll batch production suitability, and the relative simplicity of integration with thermal management materials. Flex is also capable of supporting high power and high speed applications. In this paper, we report on electrical characterization and reliability issues associated with 3-layer flex-based 3D electronic packages built at the University of Arkansas. The applications chosen were simple, but representative of the high speed and high power dissipation capabilities of flex in a 3D geometry. In the 3-layer modules, two layers contain identical VCO circuits, while the third is a DC-DC converter. The VCO, operating from 10 to 25 MHz, was chosen to demonstrate the operating speed capability of flex substrates, while the DC-DC converter, dissipating a maximum of about 5 W at an energy density of 25 Wcm-2, was chosen to demonstrate flex power handling capabilities. Air-cooling was the chosen thermal management strategy. Two types of otherwise identical modules were fabricated: one type used discrete surface mount resistors, while the other type used integrated passive (IP) resistors. Several modules of both types were fabricated and characterized for electrical, thermal, and mechanical performance. They were then subjected to reliability testing using thermal cycling and thermal shock per MIL-883E test standards. This paper discusses the fabrication and reliability testing of these 3D modules.


    Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    DUO-FLEX COMPACT ELECTRICAL PLATFORM FOR MOTORCYCLES

    SORIANO MARCO ANTONIO / BRIOSCHI CESARE | European Patent Office | 2023

    Free access

    DUO-FLEX COMPACT ELECTRICAL PLATFORM FOR MOTORCYCLES

    SORIANO MARCO ANTONIO / BRIOSCHI CESARE | European Patent Office | 2021

    Free access

    DUO-FLEX COMPACT ELECTRICAL PLATFORM FOR MOTORCYCLES

    SORIANO MARCO ANTONIO / BRIOSCHI CESARE | European Patent Office | 2022

    Free access

    Preliminary Reliability Evaluation of Flip Chip on Flex Interconnect Technology

    Virmani, N. / Shaw, J. / European Space Agency | British Library Conference Proceedings | 1997


    MCDA/FLEX

    Dietrich, Daniel | AIAA | 2010