Polyimide flex is an accepted substrate material for commercial and specialized electronic packaging applications. The advantages of using flex include ease of incorporating integrated passives (IP), roll-to-roll batch production suitability, and the relative simplicity of integration with thermal management materials. Flex is also capable of supporting high power and high speed applications. In this paper, we report on electrical characterization and reliability issues associated with 3-layer flex-based 3D electronic packages built at the University of Arkansas. The applications chosen were simple, but representative of the high speed and high power dissipation capabilities of flex in a 3D geometry. In the 3-layer modules, two layers contain identical VCO circuits, while the third is a DC-DC converter. The VCO, operating from 10 to 25 MHz, was chosen to demonstrate the operating speed capability of flex substrates, while the DC-DC converter, dissipating a maximum of about 5 W at an energy density of 25 Wcm-2, was chosen to demonstrate flex power handling capabilities. Air-cooling was the chosen thermal management strategy. Two types of otherwise identical modules were fabricated: one type used discrete surface mount resistors, while the other type used integrated passive (IP) resistors. Several modules of both types were fabricated and characterized for electrical, thermal, and mechanical performance. They were then subjected to reliability testing using thermal cycling and thermal shock per MIL-883E test standards. This paper discusses the fabrication and reliability testing of these 3D modules.
3-layered 3D flex based MCM: electrical characterization and reliability issues
1999
6 Seiten, 6 Quellen
Conference paper
English
Kühlung , Leistungsgleichspannungswandler , Halbleitergehäuse , integrierte Schaltung , Zuverlässigkeit , Prüfung integrierter Schaltungen , Kunststoffgehäuse , Polymerfilm , Leistungselektronik , Widerstandsbauelement , Oberflächenmontagetechnologie , Wärmestoß , Wärmespannung , spannungsgesteuerter Oszillator , elektrische Größe , Verlustleistung , Gleichspannungswandler , Energiedichte , thermische Leistung , Temperaturwechselbeanspruchung , Multichip-Modul
Preliminary Reliability Evaluation of Flip Chip on Flex Interconnect Technology
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