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    Title :

    Low-temperature anodic bonding of silicon to silicon wafers by means of intermediate glass layers


    Contributors:
    Gerlach, A. (author) / Mass, D. (author) / Bartuch, H. (author) / Schundau, S. (author) / Kaschlik, K. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 5 , 3 ; 144-149


    Publication date :

    1999-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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