Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Gold metallizations for eutectic bonding of silicon wafers


    Contributors:
    Lani, S. (author) / Bosseboeuf, A. (author) / Belier, B. (author) / Clerc, C. (author) / Gousset, C. (author) / Aubert, J. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 10-11 ; 1021-1025


    Publication date :

    2006-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Discussion of tooling solutions for the direct bonding of silicon wafers

    Aitken, N. / Rogers, T. | British Library Online Contents | 2006


    Low-temperature anodic bonding of silicon to silicon wafers by means of intermediate glass layers

    Gerlach, A. / Mass, D. / Bartuch, H. et al. | British Library Online Contents | 1999


    High-Mobility Epitaxial Silicon Wafers

    Stermer, R. L., Jr / Fripp, A. L., Jr. / Jones, A. et al. | NTRS | 1985


    Smoother Scribing of Silicon Wafers

    Danyluk, S. | NTRS | 1986


    Reciprocating Saw for Silicon Wafers

    Morrison, A. D. / Collins, E. R., Jr. | NTRS | 1985