Concept increases productivity and wafer quality. Cutting wafers from silicon ingots produces smooth wafers at high rates with reduced blade wear. Involves straight reciprocating saw blade and slight rotation of ingot between cutting strokes. Many parallel blades combined to cut many wafers simultaneously from ingot.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Reciprocating Saw for Silicon Wafers


    Contributors:

    Published in:

    Publication date :

    1985-01-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




    Smoother Scribing of Silicon Wafers

    Danyluk, S. | NTRS | 1986


    Automated Texturization of Silicon Wafers

    Chitre, S. / Snyder, C. / Jones, G. et al. | NTRS | 1985



    High-Mobility Epitaxial Silicon Wafers

    Stermer, R. L., Jr / Fripp, A. L., Jr. / Jones, A. et al. | NTRS | 1985


    Gettering Silicon Wafers with Phosphorus

    Daiello, R. V. | NTRS | 1983