Concept increases productivity and wafer quality. Cutting wafers from silicon ingots produces smooth wafers at high rates with reduced blade wear. Involves straight reciprocating saw blade and slight rotation of ingot between cutting strokes. Many parallel blades combined to cut many wafers simultaneously from ingot.


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    Titel :

    Reciprocating Saw for Silicon Wafers


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1985-01-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    High-Mobility Epitaxial Silicon Wafers

    Stermer, R. L., Jr / Fripp, A. L., Jr. / Jones, A. et al. | NTRS | 1985



    Smoother Scribing of Silicon Wafers

    Danyluk, S. | NTRS | 1986


    Automated Texturization of Silicon Wafers

    Chitre, S. / Snyder, C. / Jones, G. et al. | NTRS | 1985


    Gettering Silicon Wafers with Phosphorus

    Daiello, R. V. | NTRS | 1983