Concept increases productivity and wafer quality. Cutting wafers from silicon ingots produces smooth wafers at high rates with reduced blade wear. Involves straight reciprocating saw blade and slight rotation of ingot between cutting strokes. Many parallel blades combined to cut many wafers simultaneously from ingot.
Reciprocating Saw for Silicon Wafers
NASA Tech Briefs ; 8 , 3
1985-01-01
Sonstige
Keine Angabe
Englisch
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