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Variable emissivity through MEMS technology
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
Test method for availability of holes in height - temperature barrier on cementation process
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Reduction in size and weight of electronic modules through the evolution of packaging design
Performance of new silicone adhesives and encapsulants at high and low temperatures
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles