Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–20 of 63 hits
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    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)

    Sattler, P.K. / Thoren, F. | Tema Archive | 1984
    Keywords: DRUCKFESTE KAPSELUNG

    Thermal modeling of secondary lithium batteries for electric vehicle/hybrid electric vehicle applications

    Al-Hallaj, S. / Selman, J.R. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management for high performance computing in spaceborne applications

    Samson, J.R. jun. / Cutting, F.M. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Thermal control systems for pod-mounted avionics

    Swain, E.F. / Letton, G.C. jun. | Tema Archive | 1979
    Keywords: VERKAPSELN

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    Silicon sensors for automotive applications

    Rouet, J.P. / Grandjean, G. | Tema Archive | 1993
    Keywords: Kapselung

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Reliability assessment of molded Smart Power Modules

    Thomas, Tina / Becker, Karl-Friedrich / Dijk, Marius van et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Reduction in size and weight of electronic modules through the evolution of packaging design

    Bergamaschi, G. / Bettini, R. | Tema Archive | 1997
    Keywords: Kapselung

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archive | 1991
    Keywords: KAPSELUNG

    Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles

    Beckedahl, P. / Tursky, W. / Scheuermann, U. | Tema Archive | 2005
    Keywords: Verkapseln

    Optimierung des Strömungsgeräusches von PKW-Generatoren. Ein Beitrag zur Senkung der Schallemission des Antriebsaggregates

    Lutz, H.J. / Bürger, K.G. / Hackett, D. et al. | Tema Archive | 1995
    Keywords: Verkapseln