Rolling ultrasonic spot-bonding method successfully joins aluminum interconnect fingers to silicon solar cells with copper metalization. Technique combines best features of ultrasonic rotary seam welding and ultrasonic spot bonding: allows fast bond cycles and high indexing speeds without use of solder or flux. Achieves reliable bonds at production rates without damage to solar cells. Bonding system of interest for all solar-cell assemblies and other assemblies using flat leads (rather than round wires).
Ultrasonic Bonding of Solar-Cell Leads
NASA Tech Briefs ; 8 , 2
1984-12-01
Miscellaneous
No indication
English
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