New technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Ultrasonic Bonding to Metalized Plastic


    Contributors:

    Published in:

    Publication date :

    1986-06-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




    Peel testing metalized films

    Bivins, L. / Smith, T. | NTRS | 1980


    Improved metalized polycarbonate capacitor

    Kellerman, H. J. | NTRS | 1979


    Particle Velocity Lag in Metalized Propellants

    Penner, S. S. / Williams, F. A. | AIAA | 1962