New technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.


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    Titel :

    Ultrasonic Bonding to Metalized Plastic


    Beteiligte:
    Conroy, B. L. (Autor:in) / Cruzan, C. T. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.06.1986



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




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