New technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.
Ultrasonic Bonding to Metalized Plastic
NASA Tech Briefs ; 10 , 1
01.06.1986
Sonstige
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Englisch
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