Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.


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    Title :

    Bonding aluminum beam leads


    Contributors:

    Published in:

    Publication date :

    1978-03-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English






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