Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.
Bonding aluminum beam leads
NASA Tech Briefs ; 2 , 4
1978-03-01
Miscellaneous
No indication
English
1992 Thermocompression Bonding of Gold Beam Leads
SAE Technical Papers | 1974
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