Rolling ultrasonic spot-bonding method successfully joins aluminum interconnect fingers to silicon solar cells with copper metalization. Technique combines best features of ultrasonic rotary seam welding and ultrasonic spot bonding: allows fast bond cycles and high indexing speeds without use of solder or flux. Achieves reliable bonds at production rates without damage to solar cells. Bonding system of interest for all solar-cell assemblies and other assemblies using flat leads (rather than round wires).


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Ultrasonic Bonding of Solar-Cell Leads


    Beteiligte:
    Frasch, W. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1984-12-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Bonding aluminum beam leads

    Burkett, F. S. | NTRS | 1978


    Bonding Solar-Cell Modules

    Coulter, D. R. / Cuddihy, E. F. / Plueddemann, E. F. | NTRS | 1985



    Ultrasonic Bonding to Metalized Plastic

    Conroy, B. L. / Cruzan, C. T. | NTRS | 1986