Report discusses totally-automated oxidation and diffusion facility for fabricating IC's. Several innovations are demonstrated: process controller specifically designed for semiconductor processing; automatic loading system to accept wafers from air track, insert them in quartz carrier, and place carrier on paddle for insertion into furnace; automatic unloading of wafers back onto air track; and boron diffusion using diborane.


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    Title :

    An automated oxide and diffusion facility for IC's


    Contributors:

    Published in:

    Publication date :

    1980-09-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English





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