Report discusses totally-automated oxidation and diffusion facility for fabricating IC's. Several innovations are demonstrated: process controller specifically designed for semiconductor processing; automatic loading system to accept wafers from air track, insert them in quartz carrier, and place carrier on paddle for insertion into furnace; automatic unloading of wafers back onto air track; and boron diffusion using diborane.
An automated oxide and diffusion facility for IC's
NASA Tech Briefs ; 5 , 2
1980-09-01
Miscellaneous
No indication
English
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