Report discusses totally-automated oxidation and diffusion facility for fabricating IC's. Several innovations are demonstrated: process controller specifically designed for semiconductor processing; automatic loading system to accept wafers from air track, insert them in quartz carrier, and place carrier on paddle for insertion into furnace; automatic unloading of wafers back onto air track; and boron diffusion using diborane.


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    Titel :

    An automated oxide and diffusion facility for IC's


    Beteiligte:
    Kennedy, B. W. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.09.1980



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :



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