Precise passive alignment packaging technology on a Si optical bench has been developed using novel AuSn solder-bump flip-chip bonding. High accuracy (/spl plusmn/1 /spl mu/m) in the horizontal and vertical alignment of an optical chip was attained.
Passive alignment packaging on Si optical bench using AuSn solder bumps
1997-01-01
358212 byte
Conference paper
Electronic Resource
English
Passive Alignment Packaging on Si Optical Bench Using AuSn Solder Bumps
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