Precise passive alignment packaging technology on a Si optical bench has been developed using novel AuSn solder-bump flip-chip bonding. High accuracy (/spl plusmn/1 /spl mu/m) in the horizontal and vertical alignment of an optical chip was attained.


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    Title :

    Passive alignment packaging on Si optical bench using AuSn solder bumps


    Contributors:
    Itoh, M. (author) / Sasaki, J. (author) / Uda, A. (author)


    Publication date :

    1997-01-01


    Size :

    358212 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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