Precise passive alignment packaging technology on a Si optical bench has been developed using novel AuSn solder-bump flip-chip bonding. High accuracy (/spl plusmn/1 /spl mu/m) in the horizontal and vertical alignment of an optical chip was attained.
Passive alignment packaging on Si optical bench using AuSn solder bumps
01.01.1997
358212 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Passive Alignment Packaging on Si Optical Bench Using AuSn Solder Bumps
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