We describe flip chip bonding of arrayed VCSELs and PIN detectors onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 3.125 Gbps multimode parallel optical fiber links at 850 nm.


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    Title :

    Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration


    Contributors:
    Kuznia, C.B. (author) / Albares, D.J. (author) / Pendleton, M. (author) / Wong, M. (author) / Englekirk, M. (author) / Le, T. (author) / Thai, S. (author) / Divakar, M.P. (author) / Weiss, R. (author) / Cable, J. (author)


    Publication date :

    2001-01-01


    Size :

    432338 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English