Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Demonstration of a dense, high-speed optoelectronic technology integrated with silicon CMOS via flip-chip bonding and substrate removal


    Contributors:

    Conference:

    Meeting, Optical computing ; 1995 ; Salt Lake City; UT



    Publication date :

    1995-01-01


    Size :

    3 pages



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration

    Kuznia, C.B. / Albares, D.J. / Pendleton, M. et al. | IEEE | 2001


    Flip-chip bonding of high-speed laser diodes

    Lindgren, S. / Ahlfeldt, H. / Kerzar, B. et al. | IEEE | 1996


    Flip-Chip Bonding of High-Speed Laser Diodes

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1996



    Flip-Chip Bonding of VCSEL Arrays with Silicon Driver Chips for High Speed Data Links

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1998