We describe flip chip bonding of arrayed VCSELs and PIN detectors onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 3.125 Gbps multimode parallel optical fiber links at 850 nm.
Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration
2001-01-01
432338 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
ThR2 Ultra-Thin Silicon-on-Sapphire for Flip-Chip based CMOS/Optoelectronic Device Integration
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