Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding
Journal of lightwave technology ; 37 , 2 ; 307-313
01.01.2019
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 621.3692 |
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Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding
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