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    Title :

    Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding


    Published in:

    Publication date :

    2019-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    621.3692




    Hybrid integration for silicon photonics applications

    Grenouillet, L. / Dupont, T. / Philippe, P. et al. | British Library Online Contents | 2012


    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995


    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997


    Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration

    Kuznia, C.B. / Albares, D.J. / Pendleton, M. et al. | IEEE | 2001