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    Title :

    Hot embossing of transparent high aspect ratio micro parts


    Contributors:
    Kolew, A. (author) / Heilig, M. (author) / Schneider, M. (author) / Münch, D. (author) / Ezzat, R. (author) / Schneider, N. (author) / Worgull, M. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 20 , 10-11 ; 1967-1973


    Publication date :

    2014-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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