SOI wafer mold with high-aspect-ratio microstructures for hot embossing process
MICROSYSTEM TECHNOLOGIES ; 10 ; 544-546
2004-01-01
3 pages
Article (Journal)
English
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Ultraviolet embossing for patterning high aspect ratio polymeric microstructures
British Library Online Contents | 2003
|Hot embossing of transparent high aspect ratio micro parts
British Library Online Contents | 2014
|British Library Online Contents | 2008
|British Library Online Contents | 2002
|Fabrication of high-aspect-ratio hydrogel microstructures
British Library Online Contents | 2005
|