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    Title :

    SOI wafer mold with high-aspect-ratio microstructures for hot embossing process


    Contributors:
    Zhao, Y. (author) / Cui, T. (author)

    Published in:

    Publication date :

    2004-01-01


    Size :

    3 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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