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    Title :

    Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning


    Contributors:
    Yeo, L. P. (author) / Joshi, S. C. (author) / Lam, Y. C. (author) / Chan-Park, M. B. (author) / Hardt, D. E. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 4 ; 581-593


    Publication date :

    2009-01-01


    Size :

    13 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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