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    Title :

    Analysis of the demolding forces during hot embossing


    Contributors:
    Guo, Y. (author) / Liu, G. (author) / Zhu, X. (author) / Tian, Y. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 13 , 5-6 ; 411-415


    Publication date :

    2007-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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