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    Title :

    A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array


    Contributors:
    Wang, Y. (author) / Zhang, Q. (author) / Gan, D. (author) / Kuang, X. (author) / Ding, Y. (author) / Chen, F. (author) / Liu, H. (author)

    Published in:

    Publication date :

    2013-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    500



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