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    Title :

    Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers


    Contributors:
    Mei, F. (author) / Chen, K. (author) / Lu, B. (author) / Meng, W. J. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 7 ; 1111-1118


    Publication date :

    2009-01-01


    Size :

    8 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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