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    Title :

    Eutectic bonding of Al-based high aspect ratio microscale structures


    Contributors:
    Mei, F. (author) / Jiang, J. (author) / Meng, W. J. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 13 , 7 ; 723-730


    Publication date :

    2007-01-01


    Size :

    8 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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