Flip chip bonding by use of solder bumps has been widely developed to hybridize active devices such as lasers, detectors, and amplifiers, onto silicon microbenches. We report here a new method allowing hybridization of any kind of substrate onto a silicon submount with a passive and high precision self alignment process, the substrate being held in three dimensions, allowing coupling of waveguides to multiple fibers. Moreover the system allows a detachable configuration and avoids any additional micromachining of the waveguide substrate. Alignment of the waveguide axis with the V-grooves axis was obtained with an accuracy better than 2 /spl mu/m. Preliminary results indicate that the excess loss during the self-alignment and coupling of a fiber by insertion in a V-groove compared to an active alignment was typically of -3 dB.


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    Titel :

    Mechanical clip-on and flip-chip assembly on silicon submount for self aligned fiber to waveguide coupling


    Beteiligte:
    Porte, H. (Autor:in) / Armbruster, V. (Autor:in) / Kaou, N. (Autor:in) / de Labachelerie, M. (Autor:in) / Mollier, P. (Autor:in) / Devoldere, N. (Autor:in)


    Erscheinungsdatum :

    01.01.1999


    Format / Umfang :

    217052 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch





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