Flip chip bonding by use of solder bumps has been widely developed to hybridize active devices such as lasers, detectors, and amplifiers, onto silicon microbenches. We report here a new method allowing hybridization of any kind of substrate onto a silicon submount with a passive and high precision self alignment process, the substrate being held in three dimensions, allowing coupling of waveguides to multiple fibers. Moreover the system allows a detachable configuration and avoids any additional micromachining of the waveguide substrate. Alignment of the waveguide axis with the V-grooves axis was obtained with an accuracy better than 2 /spl mu/m. Preliminary results indicate that the excess loss during the self-alignment and coupling of a fiber by insertion in a V-groove compared to an active alignment was typically of -3 dB.
Mechanical clip-on and flip-chip assembly on silicon submount for self aligned fiber to waveguide coupling
1999-01-01
217052 byte
Conference paper
Electronic Resource
English
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