A flip-chip packaging technique with submicron alignment precision, using V-grooved Si motherboards, allows the realization of OEIC modules with self-aligned coupling of single mode fiber arrays to waveguide arrays together with direct optical connection of different, separately optimized waveguide devices. The passive optical self-alignment of array interconnections combined with the relatively large mounting and etching tolerances of the Si motherboard is promising as a generally useful, high precision, low cost packaging technique for OEICs.
Low-loss, self-aligned flip-chip technique for interchip and fiber array to waveguide OEIC packaging
Proceedings of LEOS'94 ; 2 ; 269-270 vol.2
01.01.1994
324993 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Low-Loss, Self-Aligned Flip-Chip Technique for Interchip and Fiber Array to Waveguide OEIC Packaging
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