A flip-chip packaging technique with submicron alignment precision, using V-grooved Si motherboards, allows the realization of OEIC modules with self-aligned coupling of single mode fiber arrays to waveguide arrays together with direct optical connection of different, separately optimized waveguide devices. The passive optical self-alignment of array interconnections combined with the relatively large mounting and etching tolerances of the Si motherboard is promising as a generally useful, high precision, low cost packaging technique for OEICs.


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    Titel :

    Low-loss, self-aligned flip-chip technique for interchip and fiber array to waveguide OEIC packaging


    Beteiligte:
    Hunziker, W. (Autor:in) / Vogt, W. (Autor:in) / Hess, R. (Autor:in) / Melchior, H. (Autor:in)

    Erschienen in:

    Proceedings of LEOS'94 ; 2 ; 269-270 vol.2


    Erscheinungsdatum :

    01.01.1994


    Format / Umfang :

    324993 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Low-Loss, Self-Aligned Flip-Chip Technique for Interchip and Fiber Array to Waveguide OEIC Packaging

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