Discusses how ceramic surface-mounted LCCs are destined to displace flatpack and chip-and-wire hybrid assemblies in military and other high-reliability systems.
Surface mounting and leadless chip carriers high in performance
Bauelemente fuer Oberflaechenmontage und leadless-chip-carriers verfuegen ueber hohe Leistungsfaehigkeit
Defense Electronics ; 16 , 2 ; 106-117
1984
12 Seiten, 2 Quellen
Article (Journal)
English
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