Discusses how ceramic surface-mounted LCCs are destined to displace flatpack and chip-and-wire hybrid assemblies in military and other high-reliability systems.


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    Title :

    Surface mounting and leadless chip carriers high in performance


    Additional title:

    Bauelemente fuer Oberflaechenmontage und leadless-chip-carriers verfuegen ueber hohe Leistungsfaehigkeit


    Contributors:

    Published in:

    Defense Electronics ; 16 , 2 ; 106-117


    Publication date :

    1984


    Size :

    12 Seiten, 2 Quellen


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English




    Solder Life Prediction for Leadless Chip Carriers

    McKeown, S. A. / IEEE / AIAA | British Library Conference Proceedings | 1992