Bendix ENCD has successfully designed and tested a large leadless chip carrier module. This paper chronicles the development and provides construction details of the module. This paper describes the advantages and disadvantages of this type of packaging and the rationale for entering such a program. The constrined board approach used is contrasted with alternate approaches and inherent problems are detailed. Analysis predictions and measurement data are presented on the edge effect phenomenon of constrained boards. The development of a bonding system is detailed along with tests for development and process control. Solder joint failure mechanisms are described and illustrations of grain growth and crack propagation are shown. Types of board construction assembly options, methods of fabrication, and board artwork guidelines are examined. Vibration sensitivity is detailed and solder failure data shown. Having detailed a generic leadless chip carrier module suitable for severe environments, the paper concludes with design recommendations.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Digital electronic engine controls and leadless chip carriers


    Additional title:

    Digitale elektronische Triebwerksteuerung und leitungsfreie Chiptraeger


    Contributors:


    Publication date :

    1986


    Size :

    8 Seiten, 23 Bilder


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Solder Life Prediction for Leadless Chip Carriers

    McKeown, S. A. / IEEE / AIAA | British Library Conference Proceedings | 1992



    Surface mounting and leadless chip carriers high in performance

    Reynolds, R.A. / Stirling, K. | Tema Archive | 1984



    Truck electronic engine controls

    Blevins,J.R. / Stephan,J.J. / TRW,US | Automotive engineering | 1982