Bendix ENCD has successfully designed and tested a large leadless chip carrier module. This paper chronicles the development and provides construction details of the module. This paper describes the advantages and disadvantages of this type of packaging and the rationale for entering such a program. The constrined board approach used is contrasted with alternate approaches and inherent problems are detailed. Analysis predictions and measurement data are presented on the edge effect phenomenon of constrained boards. The development of a bonding system is detailed along with tests for development and process control. Solder joint failure mechanisms are described and illustrations of grain growth and crack propagation are shown. Types of board construction assembly options, methods of fabrication, and board artwork guidelines are examined. Vibration sensitivity is detailed and solder failure data shown. Having detailed a generic leadless chip carrier module suitable for severe environments, the paper concludes with design recommendations.
Digital electronic engine controls and leadless chip carriers
Digitale elektronische Triebwerksteuerung und leitungsfreie Chiptraeger
1986
8 Seiten, 23 Bilder
Conference paper
English
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