Metal interconnection pattern deposited on integrated circuit or solar cell economically by thermal decomposition of metallo-organic compound. In proposed process beam from laser or quartz lamp swept over substrate in required metalization pattern; wherever beam impinges on substrate, radiant heat decomposes compound, depositing metal. Process requires less costly equipment and less time than conventional metalization. Process readily adaptable to very-large-scale integrated (VLSI) circuits.


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    Title :

    Metalization Patterns by Thermal Decomposition


    Contributors:

    Published in:

    Publication date :

    1986-01-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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