Postsintering process increases yield of double-layer metal conductors to almost 100 percent. When wafers containing double-metalized chips are sintered, metal layers react with oxide film remaining in insulation layer holes, breaking it up so that it no longer impedes electric current. Cooling also mechanically disrupts oxide film.
Double metalization for VLSI
NASA Tech Briefs ; 5 , 2
1980-09-01
Miscellaneous
No indication
English
Tests on Double Layer Metalization
NTRS | 1983
|Progress in MOSFET double-layer metalization
NTRS | 1980
|Multilayer metalization of MOS IC's
NTRS | 1980
|Metalization Patterns by Thermal Decomposition
NTRS | 1986
|