Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Low Temperature Wafer Direct Bonding Between GaInAsP Etch Stop Layer and Gd/sub 3/Ga/sub 5/O/sub 12/


    Contributors:
    Yokoi, H. (author) / Mizumoto, T. (author)


    Publication date :

    1998-01-01


    Size :

    111093 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Wafer surface treatment for bonding GaInAsP and magnetooptic garnet

    Mizumoto, T. / Yokoi, H. / Shimizu, M. et al. | IEEE | 1999


    Contact angle measurement of GaInAsP surfaces for wafer direct bonding with garnet crystals

    Yokoi, H. / Mizumoto, T. / Futakuchi, N. et al. | IEEE | 1999


    Wafer Surface Treatment for Bonding GaInAsP and Magnetooptic Garnet

    IEEE | British Library Conference Proceedings | 1999


    MULTI-FUNCTIONAL LAYER FOR STOP ETCH IN LASER COATING REMOVAL

    KNIGHT MARK W / SHINDO PATRICK W / LIMBURG CONNOR et al. | European Patent Office | 2024

    Free access

    MULTI-FUNCTIONAL LAYER FOR STOP ETCH IN LASER COATING REMOVAL

    KNIGHT MARK / SHINDO PATRICK / LIMBURG CONNOR et al. | European Patent Office | 2023

    Free access