We have demonstrated flip chip bonded vertical cavity surface emitting lasers (VCSELs) that have been bonded directly to the mesa. We have seen that flip chip bonding to the mesa has given lowered thermal impedance compared to side flip-chip and die bonded VCSELs. An array of devices has been run for 1600 hours without failure.


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    Title :

    Reliability of direct mesa flip-chip bonded VCSELs


    Contributors:


    Publication date :

    2004-01-01


    Size :

    91105 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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