We have demonstrated flip chip bonded vertical cavity surface emitting lasers (VCSELs) that have been bonded directly to the mesa. We have seen that flip chip bonding to the mesa has given lowered thermal impedance compared to side flip-chip and die bonded VCSELs. An array of devices has been run for 1600 hours without failure.


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    Titel :

    Reliability of direct mesa flip-chip bonded VCSELs


    Beteiligte:
    Teitelbaum, M. (Autor:in) / Goossen, K.W. (Autor:in)


    Erscheinungsdatum :

    01.01.2004


    Format / Umfang :

    91105 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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