We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.


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    Titel :

    Development of flip-chip 1300 nm VCSELs


    Beteiligte:
    Louderback, D.A. (Autor:in) / Stone, R.V. (Autor:in) / Graham, K.G. (Autor:in) / Guilfoyle, P.S. (Autor:in) / Choquette, K.D. (Autor:in) / Klem, J.F. (Autor:in) / Serkland, D.K. (Autor:in)


    Erscheinungsdatum :

    01.01.2002


    Format / Umfang :

    133059 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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