We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.
Development of flip-chip 1300 nm VCSELs
The 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society ; 2 ; 691-692 vol.2
01.01.2002
133059 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
ThH4 Development of Flip-Chip 1300 nm VCSELs
British Library Conference Proceedings | 2002
|Reliability of direct mesa flip-chip bonded VCSELs
IEEE | 2004
|Flip-chip Bonded VCSELs with Integrated Microlenses for Free-Space Optical Interconnects
British Library Conference Proceedings | 1997
|