We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.
Development of flip-chip 1300 nm VCSELs
The 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society ; 2 ; 691-692 vol.2
2002-01-01
133059 byte
Conference paper
Electronic Resource
English
ThH4 Development of Flip-Chip 1300 nm VCSELs
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