We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.


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    Title :

    Development of flip-chip 1300 nm VCSELs


    Contributors:


    Publication date :

    2002-01-01


    Size :

    133059 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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