Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURE
LASERSCHWEISSVORRICHTUNG FÜR DREIDIMENSIONALE STRUKTUR
APPAREIL DE SOUDAGE LASER POUR STRUCTURE TRIDIMENSIONNELLE
2024-10-30
Patent
Electronic Resource
English
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / F21S Ortsfeste Leuchten , NON-PORTABLE LIGHTING DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein / B23K Löten , SOLDERING OR UNSOLDERING |
Quick-release airborne three-dimensional laser mobile measurement structure
European Patent Office | 2024
|European Patent Office | 2022
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