Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.


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    Title :

    LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURE


    Additional title:

    LASERSCHWEISSVORRICHTUNG FÜR DREIDIMENSIONALE STRUKTUR
    APPAREIL DE SOUDAGE LASER POUR STRUCTURE TRIDIMENSIONNELLE


    Contributors:

    Publication date :

    2024-10-30


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / F21S Ortsfeste Leuchten , NON-PORTABLE LIGHTING DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein / B23K Löten , SOLDERING OR UNSOLDERING



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