The invention provides a wafer lifting device, wafer drying equipment and a wafer lifting method. The wafer lifting device comprises a power assembly; the bottom jacking assembly is used for supporting the lower side of the wafer and jacking the wafer upwards in the vertical direction, the bottom jacking assembly comprises a first jacking unit and a second jacking unit, and the first jacking unit and the second jacking unit are driven by the power assembly to ascend and descend independently; the top conveying assembly is used for being matched with the bottom jacking assembly to clamp the wafer when the wafer is jacked to a first position and conveying the wafer upwards, and the top conveying assembly is driven by the power assembly to synchronously ascend and descend with the bottom jacking assembly in the vertical direction; and the control assembly is used for controlling the first jacking unit, the second jacking unit and the top conveying assembly to be connected into the power source of the power assembly for lifting action in a time-sharing mode based on a preset control strategy. According to the wafer lifting device, the wafer drying equipment and the wafer lifting method provided by the invention, the wafer lifting stability can be improved, and the product yield can be improved.

    本公开提供了一种晶圆提升装置、晶圆干燥设备及晶圆提升方法,该装置包括:动力组件;底部顶升组件,用于承托晶圆的下侧沿竖直方向向上顶升晶圆,底部顶升组件包括第一顶升单元和第二顶升单元,第一顶升单元和第二顶升单元在动力组件的驱动下彼此独立地升降;顶部运送组件,用于当晶圆被顶升至第一位置时与底部顶升组件配合夹持晶圆、并向上运送晶圆,顶部运送组件受动力组件的驱动与底部顶升组件沿竖直方向同步升降;控制组件,用于基于预定控制策略,分时控制第一顶升单元、第二顶升单元及顶部运送组件接入动力组件的动力源进行升降动作。本公开提供的晶圆提升装置、晶圆干燥设备及晶圆提升方法,可提高晶圆提升稳定性,提高产品良率。


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    Title :

    Wafer lifting device, wafer drying equipment and wafer lifting method


    Additional title:

    一种晶圆提升装置、晶圆干燥设备及晶圆提升方法


    Contributors:
    HAO YINZUO (author)

    Publication date :

    2024-03-08


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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