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    Title :

    Virtual validation of electronic system packaging using reliability criterion of an electronic component at its solder joint


    Additional title:

    Virtuelle Validierung des Packaging eines elektronischen Systems anhand eines Zuverlaessigkeitskriteriums fuer eine elektronische Komponente an ihrer Loetverbindung.


    Contributors:
    Li,R. (author) / Kang,A. (author) / Motorola,US

    Publication date :

    2006


    Size :

    5 pages


    Remarks:

    SAE-Paper;2006-01-1613;2006;Reliability and Robust Design in Automotive Engineering;SAE Spec.Publ.; SP-2032


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English