The design methodology for reliable electronic packaging for automotive electronic applications is discussed. Sources of reliability problems are also discussed. Examples are given to illustrate the features of several key interconnects in hybrid, thick-film devices in which material selection and design are critical. Some examples of reliable design models are given.
Electronic packaging reliability in automotive applications
Zuverlässigkeit elektronischer Packungsdichten bei automativen Anwendungen
Automotive Power Electronics ; 79-83
1989
5 Seiten
Conference paper
English
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