The design methodology for reliable electronic packaging for automotive electronic applications is discussed. Sources of reliability problems are also discussed. Examples are given to illustrate the features of several key interconnects in hybrid, thick-film devices in which material selection and design are critical. Some examples of reliable design models are given.


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    Title :

    Electronic packaging reliability in automotive applications


    Additional title:

    Zuverlässigkeit elektronischer Packungsdichten bei automativen Anwendungen


    Contributors:

    Published in:

    Publication date :

    1989


    Size :

    5 Seiten


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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