Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Thermal reliability prediction of automotive electronic packaging


    Additional title:

    Vorhersage der thermischen Zuverlaessigkeit des Packaging der Kraftfahrzeugelektronik.


    Contributors:

    Publication date :

    1995


    Size :

    12 pages


    Remarks:

    SAE-Paper;950991;1995


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



    Thermal Reliability Prediction of Automotive Electronic Packaging

    Jih, E. / Reddy, V. / Pao, Y. -H. | SAE Technical Papers | 1995


    Automotive electronic reliability prediction

    Denson,W.K. / Priore,M.G. / IIT Research Inst.,US | Automotive engineering | 1987


    Automotive Electronic Reliability Prediction

    Priore, Mary G. / Denson, William K. | SAE Technical Papers | 1987


    Electronic packaging reliability in automotive applications

    Winterbottom, W.L. | Tema Archive | 1989


    Reliability Prediction of Automotive Electronics

    Flint,S.J. / IIT Res.Inst.,Reliab.Anal.Cent.,US | Automotive engineering | 1981